Fully automatic wird bonder with a huge work area Joining Technology Wire Bonding. Wedge-Wedge Fine Wire; Deep Access Wedge-Wedge Fine Wire; Wedge-Wedge Heavy Wire; Wedge

Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use. MODEL 7374E adapted for

This catalog offers our wide range of workholders for standard and customized applications, suitable for use with all types of manual bonders (MPP and other suppliers). The MPP Manual Wire Bonder department continues to develop advanced workholders designed to fit our customer's specific application needs and requirements.

5. Semi-Auto Bonding 6. Manual Z Bonding 7. Spotlight Adjustment 8. Standard Wedge Tool and Wire Specifications for Au Wire Configuration . CRITICAL PRECAUTIONS AND COMMON MISTAKES • Keep hands out of the working a rea while the Bonding Tool is in operation • Be aware of high temperature of the work holder and use tweezers when placing the

Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.

bond. Initiation of bonding is upon the opening of the firing switch. The elevation at which to feed new wire is measured from each bond by an optical encoder on the Z Axis. More importantly,

This comprehensive capability enables gold and copper ball bond and stud bumping, coining, single-point TAB bond, thermosonic, aluminium or gold wedge bonding 

2) Turn on the Bonder by flipping the power switch on. 3) Make sure the compressed air is turned on. 4) Observe the settings displayed on the screen. The only parameters that should be adjusted are Power and Time. Set both appropriately to allow the wire to bond readily to the pad and to avoid damaging the pad with excessive power/heat. a.

WIRE BONDER for the development and production of microchips and DIE BONDER for placing microchips. Wire Bonder. HB05; HB10; HB16; HB100; HB30; Overview; Die Bonder. HB75; H80;

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding 

Wire bonders for ball and wedge bonding on the same machine. Gold, aluminum, copper, platinum wires and ribbons up to diameters of 75um or sections of 

Motorized Tail Control; 4" TFT Display for Easy Control of all Bond Parameters; Simple Change between Ball Bonding and Wedge Bonding; Deep Access Bondhead 

Model 676 is a thermosonic wedge bonder for use with gold wire & gold or aluminum ribbon. It is a deep-access, long-reach bonder. In some applications it can be used to bond copper, silver, palladium-silver and up to 1.5 mil platinum wire. Model 522A Ball Bonder. Model 522A is a manual thermosonic ball bonder for use with 0.7 to 2.0 mil gold wire.

Feb 26,  · Our customers enjoy the added value that doing business with MPP – a company with over 40 years of wire bonding experience – provides. Including: Install base of 9000+

Search for used manual wire bonder. Find Kulicke & Soffa, West Bond, Hughes, Palomar, and Orthodyne for sale on Machinio.

Manual Wire Bonders - NDC International. NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada. The long time leader in wire

The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user with access to all of the bond parameters and bonding recepies stored on the machine.

We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access

Kulicke & Soffa iBond5000 Manual Wire Bonder for wedge and ball bonding of: - Al wires (20-76 μm) - Au wires (12.7-76 μm) - ribbons (up to 25 x 250 μm) 

WEST•BOND MODEL 7476D SERIES INSTRUCTION MANUAL Page 5 FEATURES DESCRIPTION Feature -45E: Free Furnace, 2"x2" Adapter, Vacuum Hold The "E" version of the basic-45 Free Furnace modifies the upper portion of the furnace to extend its surface area to 2.000"(50.8mm) x 2.000"(50.8mm).

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

5. Semi-Auto Bonding 6. Manual Z Bonding 7. Spotlight Adjustment 8. Standard Wedge Tool and Wire Specifications for Au Wire Configuration . CRITICAL PRECAUTIONS AND COMMON MISTAKES • Keep hands out of the working a rea while the Bonding Tool is in operation • Be aware of high temperature of the work holder and use tweezers when placing the

The general difference between "Automatic" bonding wedges and "Manual" bonding wedges The notch style wedge is designed for use on manual wire bonders.

Mech-El provides a full line of manual wire bonders for ultrasonic, thermosonic, and thermocompression bonding. Mech-El will continue to produce the 700, 800, 900 and 1200 series of bonders. Mech-el bonders will come with the MEI Manufacturers warranty. Mech-El is the only factory authorized service center. We provide prompt service and support.

West Bond 7476D Manual Wire Bonder SOP . 4/29/2020. 2 Operation Tips: Figure 1. schematic of wedge bonding • Make sure that your package and dies are clean. Photoresist residue, fingerprints, acetone/alcohol residue, on any surface to be bonded will make bonding difficult or

5330. Manual. Wire Bonder. The. Wedge-Wedge-Bonder. 5330 can process aluminium and gold wires from 17,5 to 75 μm. Due to the new designed.